The European Chips Skills Academy (ECSA) proudly participated in the 3D & Systems Summit 2025, hosted by SEMI Europe, held from July 29–31 in Dresden. Representing both ECSA and the European Chips Diversity Alliance (ECDA), Kartikey Srivastava brought forward the shared mission to close the skills gap and build a more inclusive semiconductor workforce.
Closing the Skills Gap, One Connection at a Time
The summit convened leaders from across the semiconductor value chain to explore the latest in 3D integration, advanced packaging, and heterogeneous systems. Alongside technical advancements, key conversations focused on workforce development, education, and the critical need to invest in people.
Kartikey Srivastava highlighted how ECSA and ECDA are working to connect students and young professionals with industry through concrete, collaborative solutions. From strengthening vocational education and training (VET) pathways to promoting cross-border mobility and inclusion, the initiatives reflect a growing need to align Europe’s chips ambition with a strong, diverse talent pipeline.
Europe’s Next Gen Takes the Stage
With the Next Gen Talent initiative in focus, the summit provided an ideal platform to align the efforts of academia, industry, and public institutions. Sessions reinforced the importance of building hands-on training opportunities, enabling smoother transitions into the sector, and ensuring talent from all backgrounds can access careers in microelectronics.
Kartikey also presented highlights from the Skills Strategy Report 2024, outlining key priorities for Europe to secure long-term semiconductor leadership through an integrated and future-ready skills framework.
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