The European Chips Skills Academy (ECSA or ECS-Academy) is a dynamic and forward-looking project supported by the European Union through the Erasmus+ program. Operating within the framework of the “Alliances for Sectoral Cooperation on Skills”, ECSA’s consortium is on a strategic four-year mission to address the pressing challenges faced by the microelectronics industry on the road towards the digital transition in Europe.

ECSA’s goal is ambitious yet straight forward: to bridge the gap between education and industry and foster innovative programs that confront this challenge head on.

How? By establishing a robust platform for dialogue, strategic planning, and decisive action in the realms of skills development, skills anticipation, upskilling, and reskilling of the workforce.

The project intends to enhance innovation and fortify the overall resilience of the microelectronics sector in Europe. As we strive to make a lasting impact, we intend to grow a premier alliance that can endure beyond the lifetime of the project to continue to transform challenges into opportunities for growth and success. ECSA is deeply committed to making a significant contribution to the European Union’s objectives for a seamless digital transition because, let’s face it, there’s no digital without chips!

We want to make a lasting Impact.

KEY FACTS

FUNDING

4 M €

DURATION

4 YEARS

Oct. 2023 to Sep. 2027

18

Consortium Members & Associate Partners

Focus on untapped growth through skilled
workforce.​

Build an enduring network between education & industry.

​

EQF 3 TO 8

Develop physical and virtual programs and curricula to reach a wide range of learner.

Quantify the skills gap

to better understand the current and upcoming needs of the sector.​

THREE MAIN GOALS

Developing innovative strategic approaches and collaboration between education and industry in the field of microelectronics for concrete skills development to implement the EU Skills Agenda for sustainable competitiveness, social fairness and resilience, as well as the operational implementation of the Pact for Skills in Microelectronics;
Bridging the gap between VET, higher education and industry with regard to the emerging occupational profiles and new skills required in microelectronics;
Operationalising the relevant EU instruments (EQF, ESCO, Europass, EQAVET) and competence frameworks (DigComp, EntreComp, GreenComp) in the context of microelectronics education and work.