We were delighted that Dunja Suttnig, Assoc CIPD from Infineon Technologies delivered a presentation on ECSA at the recent SIITME – IEEE International Symposium for Design and Technology in Electronic Packaging Symposium.

The presentation highlighted the project’s mission, objectives, and initiatives aimed at addressing the skills gap in the microelectronics industry.

Dunja noted that, “it was an honor to be the speaker at 30th edition of SIITME conference in Sibiu and to present the European Chips Skills Academy. Exceptional atmosphere, the company of like-minded and inspiring people, fruitful discussions and outstanding organization – these all left the lasting positive impression on me. I would like to extend my gratitude to the wonderful hosts for making this experience truly unforgettable.”

We look forward to sharing more initiatives like this with you!