We are delighted to be collaborating with Project TRIREME, Automotive Skills Alliance and Flamenco at the SIITME – IEEE International Symposium for Design and Technology in Electronic Packaging, taking place between 16-19 October in Sibiu, Romania.

ECSA will be featured at the Strategic Partnership for Education Workshop on 16 October. We are happy to inform our followers that Dunja Suttnig, Assoc CIPD from Infineon Technologies will participate in a panel discussion during the workshop.

The goal of the workshop is to discuss current needs in education, skills, and workforce in the fields of electronics, electronics packaging and microchips.

Learn More 👉 https://lnkd.in/e68nSGMF